Pacific Advanced Materials · Thermal · EMI Shielding · Graphite

Advanced Thermal Management
Materials, Engineered to Perform

A professional supplier of thermal-conductive, EMI-shielding and graphite electronic materials — trusted across EV, data center, 5G, power electronics and aerospace.

UL Certified RoHS Compliant ASTM Tested UL94 V-0
2–15W/m·K Conductivity
15+Product Families
8ASTM Standards
UL · RoHSCertified & Compliant
Applying a thermal pad to a PCB
In-house R&D design · prototype · production
01 — Company

Materials that move heat & hold the line

Pacific Advanced Materials designs, develops and manufactures thermal-conductive, EMI-shielding and graphite materials on internationally advanced, fully-automated lines — engineered for industrial, electronics, new-energy, aerospace and communications applications.

  • Automated Production

    Multiple advanced lines deliver efficient, precise, repeatable output at scale.

  • Verified to ASTM

    High-precision lab characterizes every product; batch inspection reports on request.

  • Custom Engineering

    Bespoke conductivity, thickness, hardness, shape & tack — prototype in ~2 weeks.

See the Product Range
02 — Product Center

What We Make

A focused portfolio across thermal interface, EMI shielding and graphite materials.

Thermal gap pads

Thermal Interface Materials

High-conductivity gap pads, gels, grease & phase-change — low thermal resistance from device to heat sink.

  • Silicone Gap Pad
  • Ultra-Soft Pad
  • Low-Volatile Pad
  • Fabric-Reinforced
  • Phase Change
  • Thermal Grease
  • Gel (1K / 2K)
  • Potting & Structural
EMI shielding conductive foil

EMI Shielding

Conductive fabrics and copper foils delivering ≥75 dB shielding at 10 GHz for enclosures, gaskets and grounding.

  • Conductive Fabric
  • Conductive Copper Foil
  • ≥75 dB @ 10 GHz
  • ≤60 Ω/□
Graphite thermal films

Graphite Films

Synthetic & natural graphite heat spreaders up to 1800 W/m·K in-plane for ultra-thin lateral heat transfer.

  • Synthetic Graphite
  • Natural Graphite
  • Up to 1800 W/m·K
  • 0.013–0.2 mm
03 — Applications

Industries We Serve

EV & Battery

Data Center & AI

5G & Telecom

Power Electronics

Optical Modules

Consumer & LED

04 — Manufacturing & Quality

Capabilities

Multiple automated production lines and a high-precision testing lab back every product — from mixing and coating to full performance characterization.

Verified to international ASTM standards

ASTM D5470ASTM D149ASTM D257ASTM D374 ASTM D792ASTM D2240ASTM D412UL 94
05 — Featured Product

PAM TP Series — Thermal Gap Pad

High conductivity, high compressibility and low stress — engineered for interface heat transfer between heat-generating devices and heat-sink modules (CPU/GPU, power modules, LED chips to heat sinks / cold plates).

Key Features

  • Conductivity range 2–15 W/m·K
  • Excellent compression & rebound, naturally tacky
  • Electrically insulating · RoHS compliant
  • UL certified · UL94 V-0 · -50 to 200 ℃
  • 9 models · thickness 0.3–10 mm

Applications: 5G modules · laser TV & displays · LED & power modules · automotive electronics & battery packs.

Full TP-Series Datasheet

Per-model specifications across all 9 grades — conductivity, hardness, density, dielectric strength and more — are shared on request.

Request a Quote to Unlock Free sample & selection support included

Let's engineer your thermal solution.

Free thermal design consultation, sample testing, material selection and simulation. Custom development (size, shape, conductivity, thickness, tack) in roughly two weeks.

Contact Our Engineers