Advanced Thermal Management Materials, Engineered to Perform
A professional supplier of thermal-conductive, EMI-shielding and graphite electronic materials — trusted across EV, data center, 5G, power electronics and aerospace.
Multiple automated production lines and a high-precision testing lab back every product — from mixing and coating to full performance characterization.
High conductivity, high compressibility and low stress — engineered for interface heat transfer between heat-generating devices and heat-sink modules (CPU/GPU, power modules, LED chips to heat sinks / cold plates).
Key Features
Conductivity range 2–15 W/m·K
Excellent compression & rebound, naturally tacky
Electrically insulating · RoHS compliant
UL certified · UL94 V-0 · -50 to 200 ℃
9 models · thickness 0.3–10 mm
Applications: 5G modules · laser TV & displays · LED & power modules · automotive electronics & battery packs.
Property
TP·
TP·
TP·
TP·
Std
Thermal Conductivity
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D5470
Hardness (Shore 00)
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D2240
Density
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D792
Breakdown Voltage
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D149
Tensile Strength
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D412
Flammability
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UL94
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Full TP-Series Datasheet
Per-model specifications across all 9 grades — conductivity, hardness, density, dielectric strength and more — are shared on request.
Free thermal design consultation, sample testing, material selection and simulation. Custom development (size, shape, conductivity, thickness, tack) in roughly two weeks.